2006Journal of Henan Mechanical and Electrical Engineering CollegeRequires access

Wasting Paring Method and Device of Semiconductor Material Silicon Chip

Hou Jiang-hua

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Abstract

The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.Analyzing Physics_Chemical milting silicon chip method at the foundation of existing problem,get out of abradant suspends and rubs sharpening and sticking abradant rub the method to sharpen silicon chip,two kinds of discussions rub quality index of paring the device adopted and main movement parameter and choosing and reaching.

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What this paper is about

The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.Analyzing Physics_Chemical milting silicon chip method at the foundation of existing problem,get out of abradant suspends and rubs sharpening and sticking abradant rub the method to sharpen silicon chip,two kinds of discussions rub quality index of paring the device adopted and main movement parameter and choosing and reaching.

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Available abstract

The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.Analyzing Physics_Chemical milting silicon chip method at the foundation of existing problem,get out of abradant suspends and rubs sharpening and sticking abradant rub the method to sharpen silicon chip,two kinds of discussions rub quality index of paring the device adopted and main movement parameter and choosing and reaching.

Key concepts: Sharpening, Silicon, Chip, Silicon chip, Semiconductor, Integrated circuit, Semiconductor device, Materials science

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