Wasting Paring Method and Device of Semiconductor Material Silicon Chip
Hou Jiang-hua
Abstract
Hou Jiang-hua
Abstract
The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.Analyzing Physics_Chemical milting silicon chip method at the foundation of existing problem,get out of abradant suspends and rubs sharpening and sticking abradant rub the method to sharpen silicon chip,two kinds of discussions rub quality index of paring the device adopted and main movement parameter and choosing and reaching.
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The silicon chip is a main component of the semiconductor apparatus;there is extensive application in printing the integrated circuit and miniature integrated instrument.Analyzing Physics_Chemical milting silicon chip method at the foundation of existing problem,get out of abradant suspends and rubs sharpening and sticking abradant rub the method to sharpen silicon chip,two kinds of discussions rub quality index of paring the device adopted and main movement parameter and choosing and reaching.
Key concepts: Sharpening, Silicon, Chip, Silicon chip, Semiconductor, Integrated circuit, Semiconductor device, Materials science