Optimizing tests in Electroless copper plating using Sodium Hypophosphite as reducing agent append K_4Fe(CN)_6

Electroless copper plating is the important part of the printed circuit board.In this paper,the electroless copper plating using sodium hypophosphite as reducing agent appended K4Fe(CN)6 with optimizing tests,and the best parameter and condition were reviewed.The deposition rate was decreased significantly with the addition of K4Fe(CN)6 to the plating solution,the plating became compact and uniform,and the morphology of the plating was improved.Both of the resistivity of the copper deposits and the contents of nickel in the plating were decreased.