Research Status and Prospects of Lead-free Solder in Electronic Device

The development process and research status of lead-free solder in electronic device were described,and through EDAX composition analysis of solder joints in the domestic electronic device,to study the actual application status of lead-free solder.It was showed that Sn-Pb solder was still used in the current domestic electronic devices as the main solder,but the lead content was decreased year by year.It can clearly be seen,leadfree solder have already started in the domestic electronic devices.However,to achieve complete lead-free there is still a long way to go.