2011•Unpublished venueRequires access

Calculation of Thermal Resistance of Heat Sink for Power IC Based on Icepak

Xiang Min

Abstract

Typical heat sinks for power chip in hybrid integrated circuits were described.Method for calculating its thermal resistance was presented.Modeling of heat sink and calculation of thermal resistance using thermal simulation software Icepak were discussed in detail.Calculation results were validated.Thermal resistance data for typical heat sinks were obtained by using thermal simulation modeling method.

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Key concepts: Heat sink, Thermal resistance, Thermal, Materials science, Chip, Nuclear engineering, Integrated circuit, Mechanical engineering