New Pretreatment Technology of Electroless Nickel Plating for Aluminum Alloy
Yin Guo-guang
Abstract
Yin Guo-guang
Abstract
In order to improve electroless nickel plating technology of aluminum alloy and avoid contamination in electroless nickel plating solution which was produced by zincate conversion process, a new technology of activation—pre-electroless Ni plating for aluminum alloy was investigated. The morphology of activation film and pre-electroless Ni coating was analyzed by scanning electron microscope(SEM). The optimum pH value of the activation process is in the range of 9 to 10 and the optimum thickness of the pre-electroless Ni coating is about 0.6 μm, which were identified by the tests of coating adhesion, porosity and corrosion resistance. The coating quality met the specifications of the GB/T13913—92. It showed that the technology of activation pre-electroless Ni plating could be used as a substitute for zincate conversion process. A new pretreatment technology of Ni plating was provided for aluminum alloy.
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In order to improve electroless nickel plating technology of aluminum alloy and avoid contamination in electroless nickel plating solution which was produced by zincate conversion process, a new technology of activation—pre-electroless Ni plating for aluminum alloy was investigated. The morphology of activation film and pre-electroless Ni coating was analyzed by scanning electron microscope(SEM). The optimum pH value of the activation process is in the range of 9 to 10 and the optimum thickness of the pre-electroless Ni coating is about 0.6 μm, which were identified by the tests of coating adhesion, porosity and corrosion resistance. The coating quality met the specifications of the GB/T13913—92. It showed that the technology of activation pre-electroless Ni plating could be used as a substitute for zincate conversion process. A new pretreatment technology of Ni plating was provided for aluminum alloy.
Key concepts: Zincate, Materials science, Electroless nickel plating, Alloy, Metallurgy, Plating (geology), Gold plating (software engineering), Scanning electron microscope