Research progress on thermoelectric cooling technology applied in electronic packaging thermal management

The question of heat dissipation of chips in electronic packaging device is the obstruction in its development. The heat producing characteristics, heat dissipation requirement and mode of electronic chip were reviewed. The applications of thermoelectric cooling (TEC) technology in electronic chip heat dissipation system were analyzed and pointed out the disadvantages and advantages. Furthermore, the present situation and research progress of thermoelectric cooling technology applied in electronic packaging thermal management were summerised and reviewed.