2012Electronics Process TechnologyRequires access

Through-Hole Components Soldering Method of Mixed Circuit Board

Darong Xu

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Abstract

The mix-assembly circuit board,which not only include surface mount components,but also contains the through-hole components.With the electronic assembly technology development,the soldering process for the pure surface mount components circuit board or pure through-hole components circuit board has been very mature.But for mixed circuit board soldering,there are many methods,and the process is more complicated.How to choose soldering method is given for reference.Introduce variety of soldering methods for through-hole components in mixed circuit board,and discuss the advantages and disadvantages of these soldering methods.

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What this paper is about

The mix-assembly circuit board,which not only include surface mount components,but also contains the through-hole components.With the electronic assembly technology development,the soldering process for the pure surface mount components circuit board or pure through-hole components circuit board has been very mature.But for mixed circuit board soldering,there are many methods,and the process is more complicated.How to choose soldering method is given for reference.Introduce variety of soldering methods for through-hole components in mixed circuit board,and discuss the advantages and disadvantages of these soldering methods.

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Available abstract

The mix-assembly circuit board,which not only include surface mount components,but also contains the through-hole components.With the electronic assembly technology development,the soldering process for the pure surface mount components circuit board or pure through-hole components circuit board has been very mature.But for mixed circuit board soldering,there are many methods,and the process is more complicated.How to choose soldering method is given for reference.Introduce variety of soldering methods for through-hole components in mixed circuit board,and discuss the advantages and disadvantages of these soldering methods.

Key concepts: Dip soldering, Wave soldering, Printed circuit board, Soldering, Surface-mount technology, Solder paste, On board, Electronic component

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