Optimization of electroless silver plating on glass fiber

The process for electroless silver plating on glass fiber was optimized by orthogonal test using AgNO 3 as activator and glucose as reducing agent. The effect of plating time on the resistivity of coating was studied. The optimal process parameters for electroless silver plating were determined as follows: AgNO3 6 g/L, C6H12O6 8 g/L, NH3·H2O 100 mL/L, C2H5OH 100 mL/L, NaOH 4 g/L, KI 0.5-1.0 mg/L, temperature 30 °C, and time 25 min. The results show that the resistivity of silver-coated glass fiber is decreased initially and then increased as the plating time prolongs. The silver-coated glass fiber prepared under the optimal process conditions has uniform and lustrous surface, excellent adhesion and conductivity, and a thickness of 12 μm.