2010•Journal of Taiyuan University of Science and TechnologyRequires access

Stress and Displacement Fields Around the Mixed Type Crack Tip at Bi-materials Interface

Weiyang Yang

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Abstract

Orthotropic bi-materials central interfacial crack was studied by constructing new stress function.When secular equations' discriminations are less than zero,by solving a class of generalized re-harmonic equations boundary value problems,the theoretical solutions of stress fields,displacements fields,and stress intensity factor of mixed-mode crack are obtained.The derived result has no oscillation and the crack edge have no overlap phenomenon.When the two parts of the plane have the same material parameters,the obtained stress and displacements field become the one of orthotropic single material.

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Orthotropic bi-materials central interfacial crack was studied by constructing new stress function.When secular equations' discriminations are less than zero,by solving a class of generalized re-harmonic equations boundary value problems,the theoretical solutions of stress fields,displacements fields,and stress intensity factor of mixed-mode crack are obtained.The derived result has no oscillation and the crack edge have no overlap phenomenon.When the two parts of the plane have the same material parameters,the obtained stress and displacements field become the one of orthotropic single material.

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Available abstract

Orthotropic bi-materials central interfacial crack was studied by constructing new stress function.When secular equations' discriminations are less than zero,by solving a class of generalized re-harmonic equations boundary value problems,the theoretical solutions of stress fields,displacements fields,and stress intensity factor of mixed-mode crack are obtained.The derived result has no oscillation and the crack edge have no overlap phenomenon.When the two parts of the plane have the same material parameters,the obtained stress and displacements field become the one of orthotropic single material.

Key concepts: Orthotropic material, Stress intensity factor, Stress field, Stress functions, Stress (linguistics), Crack tip opening displacement, Boundary value problem, Materials science

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