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2007•Journal of Solid Rocket TechnologyRequires access

Investigation on curing kinetics and thermal properties of a novel epoxy resin system

Sun Bao-hua

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Abstract

Curing process,curing cross-linking reaction kinetics parameters and thermal resistance of DIA/epoxy resin system were investigated by DSC under different heating-up rates,and curing degree of the system was calculated by means of FTIR method.The curing process of the resin system was determined.Apparent activation energy of the resin was calculated by using Kissinger and Ozawa methods and its average value is equal to 87.02 kJ/mol.Based on Crane formula,the calculated reaction series is 0.93.Glass transition temperature(Tg) measured by torsional braid analysis(TBA) is up to 178℃.The TG curves show that the initial decomposition temperature of the system is 364℃.

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What this paper is about

Curing process,curing cross-linking reaction kinetics parameters and thermal resistance of DIA/epoxy resin system were investigated by DSC under different heating-up rates,and curing degree of the system was calculated by means of FTIR method.The curing process of the resin system was determined.Apparent activation energy of the resin was calculated by using Kissinger and Ozawa methods and its average value is equal to 87.02 kJ/mol.Based on Crane formula,the calculated reaction series is 0.93.Glass transition temperature(Tg) measured by torsional braid analysis(TBA) is up to 178℃.The TG curves show that the initial decomposition temperature of the system is 364℃.

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Available abstract

Curing process,curing cross-linking reaction kinetics parameters and thermal resistance of DIA/epoxy resin system were investigated by DSC under different heating-up rates,and curing degree of the system was calculated by means of FTIR method.The curing process of the resin system was determined.Apparent activation energy of the resin was calculated by using Kissinger and Ozawa methods and its average value is equal to 87.02 kJ/mol.Based on Crane formula,the calculated reaction series is 0.93.Glass transition temperature(Tg) measured by torsional braid analysis(TBA) is up to 178℃.The TG curves show that the initial decomposition temperature of the system is 364℃.

Key concepts: Curing (chemistry), Epoxy, Materials science, Activation energy, Kinetics, Composite material, Glass transition, Thermal decomposition

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