2006•Chemistry and AdhesionRequires access
The Effect of Curing Agent on Properties of the Encapsulation Adhesive
Chao Wang
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Abstract
In order to meet the demand of the heat-resistant encapsulation adhesive curing at middle temperature,a kind of new encapsulation adhesive was researched.The effect of curing agent on adhesive properties of volatile matter,shear strength,glass transmission temperature and curing temperature were researched.The best ratio of phenolic resin to curing agent was obtained.The researches indicated that the self-made curing agent could decrease the volatile matter of phenolic resin,curing temperature sharply,improve shear strength,but the glass transmission temperature and shear strength at high temperature decreased slightly.