Different Concentrations of Additives on the Properties of Copper Plating

At present, copper interconnect technology have replaced the traditional aluminum wiring in VLSI interconnection. Copper is filled mainly by the ultra-Damascene process for electroplating. Organic additives, including accelerator, suppressor and leverler, although their concentration in the electroplating solution is very few, but they are crucial for the copper plating process. This paper is about studying of each type of additives' impact on copper plating.