Numerical simulation of rectangle box deep drawing
Guotai Yang
Abstract
Guotai Yang
Abstract
Forming process simulation of rectangle box deep drawing by finite element simulation was carried out to study the spring back and thickness change of rectangle box.Through adjusting the unsuitable part for rectangle box and confirming the reasonable deepness,the matter of mould repairing for many times was avoided.The results indicate that the spring back value after drawing is smaller for the modified part,which meets the design requirement completely.In addition,the thickness change of the modified rectangle box tends to be more uniform,and has more reasonable stress,especially the stress of the cavity die.The loading curve is closer to linearity.So it can reduce the impaction to the mould and is in favor of prolonging the mould life.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Forming process simulation of rectangle box deep drawing by finite element simulation was carried out to study the spring back and thickness change of rectangle box.Through adjusting the unsuitable part for rectangle box and confirming the reasonable deepness,the matter of mould repairing for many times was avoided.The results indicate that the spring back value after drawing is smaller for the modified part,which meets the design requirement completely.In addition,the thickness change of the modified rectangle box tends to be more uniform,and has more reasonable stress,especially the stress of the cavity die.The loading curve is closer to linearity.So it can reduce the impaction to the mould and is in favor of prolonging the mould life.
Key concepts: Rectangle, Finite element method, Die (integrated circuit), Deep drawing, Structural engineering, Stress (linguistics), Spring (device), Computer simulation