Flow stress behavior of a new Al-Mg-Si-Cu alloy during hot compression deformation
Yuan Dong, Peng Da-shu
Abstract
Yuan Dong, Peng Da-shu
Abstract
The flow stress of a new Al-Mg-Si-Cu alloy during hot compression deformation was investigated in the temperature range from 350℃ to 550℃ and at strain rate range from 0.005 s~(-1) to 5 s~(-1) on Gleeble-1 500 test machine.The experimental results show that the true stress-ture strain curves exhibit a peak stress at small strain(0.15),after which the flow stresses decrease monotonically until high strains,showing a dynamic softening.The flow stress values decrease with increasing deformation temperature and/or decreasing strain rate,which can be represented by a Zener-Hollomon parameter in an exponent-type equation with the hot deformation activation energy Q of 236 kJ/mol.5figs.,11refs.
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The flow stress of a new Al-Mg-Si-Cu alloy during hot compression deformation was investigated in the temperature range from 350℃ to 550℃ and at strain rate range from 0.005 s~(-1) to 5 s~(-1) on Gleeble-1 500 test machine.The experimental results show that the true stress-ture strain curves exhibit a peak stress at small strain(0.15),after which the flow stresses decrease monotonically until high strains,showing a dynamic softening.The flow stress values decrease with increasing deformation temperature and/or decreasing strain rate,which can be represented by a Zener-Hollomon parameter in an exponent-type equation with the hot deformation activation energy Q of 236 kJ/mol.5figs.,11refs.
Key concepts: Materials science, Flow stress, Deformation (meteorology), Strain rate, Softening, Compression (physics), Stress (linguistics), Metallurgy