Study on the Interfacial Adhesion between Polyamide 6 and Glass Fiber
Wenli Dai
Abstract
Wenli Dai
Abstract
Effects of the addition of three kinds of sulfonamide, n-butyl-p-toluenesulfonamide(BTSA), n-cyclohexyl-p-toluenesulfonamide(CTSA), m-phthalic-5-sulfonic acid sodium(5-SSIPA) on the interface bonding into the polyamide/glass fiber composites were studied. Scanning electron microscopy (SEM) indicated that all the three additives improved the dispersion of glass fiber in the matrix. Compared with neat composite, the dry tensile strength, yield strength, and modulus of PA6/GF/5-SSIPA system were 21. 3 % ,40. 5 % , and 60.1 % higher, respectively, and the water absorbency lowered by 2.6%. TG analysis showed that the thermal stability of the composite was also improved.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Effects of the addition of three kinds of sulfonamide, n-butyl-p-toluenesulfonamide(BTSA), n-cyclohexyl-p-toluenesulfonamide(CTSA), m-phthalic-5-sulfonic acid sodium(5-SSIPA) on the interface bonding into the polyamide/glass fiber composites were studied. Scanning electron microscopy (SEM) indicated that all the three additives improved the dispersion of glass fiber in the matrix. Compared with neat composite, the dry tensile strength, yield strength, and modulus of PA6/GF/5-SSIPA system were 21. 3 % ,40. 5 % , and 60.1 % higher, respectively, and the water absorbency lowered by 2.6%. TG analysis showed that the thermal stability of the composite was also improved.
Key concepts: Materials science, Composite material, Polyamide, Ultimate tensile strength, Thermal stability, Composite number, Glass fiber, Scanning electron microscope