Pin-through-hole Reflow Soldering Technology for Single-sided Board
Yuan Ya
Abstract
Yuan Ya
Abstract
From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment.
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From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment.
Key concepts: Soldering, Reflow soldering, Materials science, Dip soldering, Wave soldering, Printed circuit board, Mechanical engineering, Composite material