2003Electronics Process TechnologyRequires access

Pin-through-hole Reflow Soldering Technology for Single-sided Board

Yuan Ya

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Abstract

From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment.

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What this paper is about

From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment.

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Available abstract

From theory and practice,expound the feasibility of reflow technology of high dense electronic assemblies mixed pin-through-hole and SMD during large scale production,introduce the correlation equipment.

Key concepts: Soldering, Reflow soldering, Materials science, Dip soldering, Wave soldering, Printed circuit board, Mechanical engineering, Composite material

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