Study on Electroplating of Cu on Diamond Surface

In order to improve the wettability of diamond and metal matrix,by electroless plating on diamond powder surface generated copper-plate. The organization,morphology and plating rate was changed by the pH vale and additive of plating bath,which was investigated through XRD and SEM analysis. The results show that the plating rate almost was zero and no reaction can occur when the pH value was below 10. 5. When the pH value was between 10. 5 and 12. 5,the plating rate was increased with the increasing of pH value,the copper peaks in X-ray diffraction patterns of powders was found,the peak intensity was enhanced with the increasing of pH value. The plating rate was decreased with the increasing of pH value,the peak intensity was weakened with the increasing of the pH value when pH value was above 12. 5. The substrate was not covered of copper plating completely and the plating was relatively thin when the pH value was about 11. the coating was comparatively even,compact,better combining strength,definite thickness and closely when the pH value was about 12. The plating had a relatively roughness,edge curl and exfoliation phenomenon until the pH value closed to 13. It was found that adding an optimum amount of 2,2'-dipyridyl and K4Fe(CN)6to the bath could improved the stability of the bath,these two additions hindered the electroless deposition,reduced the deposition rate of copper and caused the compacter and brighter of the coating.