2005•Journal of Central South University of Technology(Natural Science)Requires access
Electroless copper plating system of potassium sodium tartrate and EDTA·2Na
Xinhai Li
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Abstract
Electroless copper plating system of potassium sodium tartrate and EDTA·2Na was investigated comprehensively. The results indicate that the copper deposition rate decreases with the increase of the concentration of potassium sodium tartrate and EDTA·2Na and plating time, and increases with the increase of the concentration of CuSO4·5H2O and HCHO, pH value and reaction temperature. Although the influences of α, α′-Dipyridyl, K4Fe(CN)6·3H2O and PEG-1000 additives on the deposition rate are small, those of these additives on the surface qualities of copper film are great. The optimal conditions of the electroless copper plating system are as follows: CuSO4·5H2O is 5.0 g/L, EDTA·2Na is 21 g/L, potassium sodium tartrate is 5.0 g, HCHO is 16 ml/L, α, α′-Dipyridyl is 8 mg/L, K4Fe(CN)6·3H2O is 70 mg/L, PEG-1000 is 1 g/L, pH value is 12.75, reaction temperature is 50 ℃. Plating for 30 min in the bath, the copper deposition rate reaches 3.4 μm/h. The SEM image demonstrates that the surface of copper film is smooth and fine.