2005•Transactions of the China Welding InstitutionRequires access
Effect of Ti on the microstructures and properties of ceramic bonded joints with intermetallic compounds
Liu Gen-mao
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Abstract
In this paper, Si_3N_4 Ceramics were bonded with Ag-Cu-Ti and Ti/Ni/Ti multi-interlayer. The joints were strengthened by intermetallic compounds formed in situ. The results showed that the thickness of Ti foil has an important influence on the microstructures, properties of joints, and status of interfacial reaction layer. Thin Ti foil is favorable for form and distribution of intermetallic compounds, but harmful for formation of interfacial reaction layer. While thick Ti foil has adverse effect on form and distribution of intermetallic compounds and interfacial reaction layer.