Development of lead-free solder for electronic assembly

In the electronic assembly with most early lead and tin soldering is mainly composed of two kinds of elements, especially for 63% of Sn and weight percentages of Pb 37% eutectic lead-tin alloy used for most electronic products.But the use of Sn/Pb alloy solder is one of the important sources of pollution in manufacture and use of Sn/Pb solder process,because of the melting temperature is higher,there are lots of lead steam escaping,will directly affected operation personnel's physical health.While the common welding interconnection of thermal fatigue failure and lead in the design phase,expectations and lead-free soldering tin does not contain lead photograph,thereby improving mechanical properties,strengthen the solder.The basic requirements,the research status,the problems faced of lead-free solder were reviewed.The opinion that lead-free solder and reliability of lead-free soldering was still a research hotspot in industry and academic was pointed out.