Research on Defect Inspection of Flip Chip Using Active Thermography

Traditional non-destructive detection methods owing to their disadvantages are insufficient for solder joint assessment.Therefore,a defect inspection method based on active thermography is proposed in this paper.In this approach,the flip chip is heated by non-contact thermal source.A commercial infrared thermal imager is employed to capture the thermal distribution on the chip.The thermal distribution and evolution indicate defects inside flip-chip.Experimental investigation is carried out.The results prove that this method has ability of detecting defects inside flip-chip,and can be applied in defects inspection and diagnosis of flip-chip.