2004•Unpublished venueRequires access
Curing Reaction Kinetics of Epoxy Resin Containing Biphenyl Structure Using DDS as Curing Agent
Chunling Zhang, Jianxin Mu, YU Wen-Zhi, MI Xin-Yan, FU Tie-zhu, Jianxun Pang, Hui Na, Zhongwen Wu
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Abstract
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