Development of Flip Chip Rework Method for High Dense Printed Circuit Board.

Flip chip attach technology has many advantages and is considered one of the most important technology in the micro joining field. However, the flip chip rework is difficult when the flip chip bonding is formed on the high density card. We developed new flip chip rework method using the solder capped chip technology. In this technology, Sn-37Pb solder, which is neccessary to form the flip chip joint again, is applied on Pb-3Sn bumps of bare chip by the paste printing method. That solder capped chip was used as the replacement chip on the rework process. This report describes the development of flip chip rework method by solder capped chip.