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2012•Journal of The Surface Finishing Society of JapanOpen access

Development of Boric Acid Free High Speed Electro Nickel Plating Bath

Ikuhiro Kato, Yohei Wakuda, Katsuhiko TASHIRO, Yasushi UMEDA, Hideo HONMA

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Abstract

For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm2, increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand.Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm2. The effect of acetic acid was attributed to its excellent buffering capability.

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For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm2, increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand.Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm2. The effect of acetic acid was attributed to its excellent buffering capability.

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Available abstract

For the field of nickel electroforming, where thickness of about 100-500 μm is obtained at the current density of 20-50 A/dm2, increase in the current density is demanded for higher plating speed. Regarding the environmental impact, a plating bath without boric acid is also in demand.Results obtained from studying various organic acids to replace boric acid show that acetic acid facilitates high-speed plating without burning at a current density of up to 200 A/dm2. The effect of acetic acid was attributed to its excellent buffering capability.

Key concepts: Boric acid, Plating (geology), Current density, Electroforming, Acetic acid, Nickel, Current (fluid), Materials science

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