2005•Journal of The Japan Institute of Electronics PackagingOpen access

Development of Examination of How to Identify Thermal Characteristic for Reflow Soldering

Yoko Kasai, Kenichiro Suetsugu, Manabu Kakino, Akio Furusawa

Abstract

Lead-free solders are promising alternatives to conventional solders for environmental reasons.However, the range of temperatures which allow the solders to melt without damaging components is narrow. In order to improve quality and reduce the development period, we have developed a reflow analysis system utilizing experiment and simulation.

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Key concepts: Soldering, Reflow soldering, Materials science, Quality (philosophy), Thermal, Metallurgy, Process engineering, Reliability engineering