Wire Bonding - A Closer Look

Just like soldering, wire bonding appears to be a simple process and is frequently taken for granted. People tend to think all that is required to have a high quality bonding process is a simple wire pull test to monitor and control the process. But like soldering, this process is complex and requires a thorough understanding of the metallurgy, thermodynamics, and surface chemistry involved. This paper will report on a study of the wire bonding which is representative of the semiconductor industry from the aspect of the materials involved, the metallurgy of the resultant bonds, and techniques of monitoring the bond quality. It will also present information on the ability of a bond to withstand various aging conditions and the most effective manner to monitor bond quality.