Hydrogenated Nanocrystalline Silicon Deposited by Hot Wirechemical Vapour Deposition at High Rate
H.B.T. Li, J.P.H. Jongen, Karine H. M. van der Werf, M. Hebbink, Ruud E. I. Schropp
Abstract
H.B.T. Li, J.P.H. Jongen, Karine H. M. van der Werf, M. Hebbink, Ruud E. I. Schropp
Abstract
In this contribution we summarize our recent investigations on the deposition of nc-Si:H materials at a deposition rate in excess of 1.0 nm/s. Techniques to characterize the material quality include structural, optical and electrical characterization methods such as Raman spectroscopy, Fourier Transform Infrared spectroscopy, Reflection/Transmission, electronic activation energy and conductivity measurements. Sub-bandgap defects are characterized by means of Constant Photocurrent Method and Photothermal Deflection Spectroscopy. It is shown that at an adequately raised substrate temperature, nc-Si:H materials with good photoresponse can be produced at a rate beyond 1.0 nm/s. Particularly, the reverse H2 profiling technique developed earlier for low-rate nc-Si:H material deposited near the a-Si:H to nc-Si:H phase transition can also be applied to this high rate material. This warrants a homogeneous structure in the growth direction. The results of the present research can be well implemented in to an in-line deposition facility, which involves a continuously moving substrate.
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In this contribution we summarize our recent investigations on the deposition of nc-Si:H materials at a deposition rate in excess of 1.0 nm/s. Techniques to characterize the material quality include structural, optical and electrical characterization methods such as Raman spectroscopy, Fourier Transform Infrared spectroscopy, Reflection/Transmission, electronic activation energy and conductivity measurements. Sub-bandgap defects are characterized by means of Constant Photocurrent Method and Photothermal Deflection Spectroscopy. It is shown that at an adequately raised substrate temperature, nc-Si:H materials with good photoresponse can be produced at a rate beyond 1.0 nm/s. Particularly, the reverse H2 profiling technique developed earlier for low-rate nc-Si:H material deposited near the a-Si:H to nc-Si:H phase transition can also be applied to this high rate material. This warrants a homogeneous structure in the growth direction. The results of the present research can be well implemented in to an in-line deposition facility, which involves a continuously moving substrate.
Key concepts: Nanocrystalline material, Materials science, Silicon, Chemical vapor deposition, Deposition (geology), Nanocrystalline silicon, Chemical engineering, Optoelectronics