Adsorption Behavior of Polyoxyethyleneglycole on the Copper Surface in an Acid Copper Sulfate Bath

The offect of polyoxyethyleneglycole (PEG) on the copper deposition and dissolution were studied in an acid copper sulfate bath as a function of electrode potential, polymerization degree of PEG and Cl - concentrations. In the presence of Cl - , PEG adsorbed on the copper surface to give an adhesive film causing remarkable suppression of the reaction current in the wide potential range of copper deposition and dissolution. While, in the Cl - free solution, PEG suppressed the reaction current in the potential range less negative than -150mV vs Cu 2 +* /Cu . Only the PEG which has the polymer ions are grasped in PEG molecules.