Embedded passive components and electronic circuits into the printed circuit board

The paper concerns on the investigations and on the development of high advanced technology of passive elements embedding into multilayered printed circuit board (PCB). The basic technologies, materials, structures and basic properties of embedded components are presented. The electrical, thermographic and environmental testing lead to the conclusion that they can replace the standard passive components assembled in Surface Mount Technology (SMT) and Through Hole Technology (THT) on the printed circuit board. The use of embedded passive components allows increase the speed, functionality, reliability and significant miniaturization of consumer and professional electronics.