TheRedistributed ChipPackage: A Breakthrough forAdvanced Packaging

TheRedistributed ChipPackage (RCP)isasubstrate-less embeddedchippackagethatoffers a low-cost, high performance, integrated alternative tocurrent wirebond BGA andflip chip BGA packaging. Devices areencapsulated into panels while routing ofsignals, power, andground isbuilt directly onthepanel. TheRCP panel andsignal build-up lowers thecostofthepackage byeliminating wafer bumping andsubstrates thereby enabling large scale assembly inpanel form.Thebuild-up provides better routing capabilities and better integration. Also, byeliminating bumping, thedevice interconnect isinherently Pb-free, andthestress ofthe package isreduced enabling ultra-low K device compatibility. Thepanel iscreated byattaching device active side downtoa substrate, encapsulating andcuring thedevices, grinding to desired thickness, andthenremoving thesubstrate. Signal, power, andground planes arecreated using redistribution-like processing. Multi-layer metal RCPpackages havepassed -40 to125Cair-to-air thermal cycling andHASTafter MSL3/260 preconditioning.