K.C. Gupta, Haki Cebi, Cheok H. Thng
Abstract
Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities.
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Effects of a metallic package on the performance of a microstrip circuit are attributed mainly to the modifications of spurious couplings among various discontinuities. This paper describes a method for computing the effect of the package shape on the interactions among discontinuities.
Key concepts: Spurious relationship, Classification of discontinuities, Microstrip, Coupling (piping), Electronic engineering, Computer science, Materials science, Engineering