Wood-Polyvinyl Chloride Composite for Insulation of Electrical Wires: Fabrication and Investigation of Properties
Mohammad Hasan Moeini, Seyed Hamid Heidary, I. S. Amiri, Arash Payami
Abstract
Mohammad Hasan Moeini, Seyed Hamid Heidary, I. S. Amiri, Arash Payami
Abstract
In this study, five series of wood—polyvinyl chloride composite samples were prepared by granules production followed by extrusion process for insulation of cuprous wires. The effects of wood flour content and its size on thermal stability, physical, mechanical, and electrical properties of these composites were investigated. The obtained results show that the density as well as the mechanical properties decreases, as the wood flour content increases. Also, wood flour composites with smaller particles have better mechanical properties and lower density. Thermal decomposition of these composites was investigated by thermogravimetric analysis (TGA). In general, thermal decomposition of polyvinyl chloride is inhibited by the addition of wood flour to the polyvinyl chloride compound. Moreover, electrical tests showed high amounts of wood flour can’t be used when high volume resistivity is necessary.
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In this study, five series of wood—polyvinyl chloride composite samples were prepared by granules production followed by extrusion process for insulation of cuprous wires. The effects of wood flour content and its size on thermal stability, physical, mechanical, and electrical properties of these composites were investigated. The obtained results show that the density as well as the mechanical properties decreases, as the wood flour content increases. Also, wood flour composites with smaller particles have better mechanical properties and lower density. Thermal decomposition of these composites was investigated by thermogravimetric analysis (TGA). In general, thermal decomposition of polyvinyl chloride is inhibited by the addition of wood flour to the polyvinyl chloride compound. Moreover, electrical tests showed high amounts of wood flour can’t be used when high volume resistivity is necessary.
Key concepts: Polyvinyl chloride, Wood flour, Materials science, Thermogravimetric analysis, Composite material, Composite number, Thermal stability, Thermal decomposition