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Intrinsic dissipation in microelectromechanical systems

Raffaele Ardito, Claudia Comi, Alberto Corigliano, Attilio Frangi

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Abstract

The numerical evaluation of intrinsic dissipation induced by thermoelastic coupling is of paramount importance in microelectromechanical systems. This paper presents a finite-element based procedure for the computation of thermoelastic dissipation in microdevices. In case of ultrathin resonators, the experiments show that damping is strongly influenced by size-dependent phenomena. In order to simulate the scale dependence of dissipation, an enhanced nonlocal coupled thermoelastic model is introduced and the first results are discussed.

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What this paper is about

The numerical evaluation of intrinsic dissipation induced by thermoelastic coupling is of paramount importance in microelectromechanical systems. This paper presents a finite-element based procedure for the computation of thermoelastic dissipation in microdevices. In case of ultrathin resonators, the experiments show that damping is strongly influenced by size-dependent phenomena. In order to simulate the scale dependence of dissipation, an enhanced nonlocal coupled thermoelastic model is introduced and the first results are discussed.

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Available abstract

The numerical evaluation of intrinsic dissipation induced by thermoelastic coupling is of paramount importance in microelectromechanical systems. This paper presents a finite-element based procedure for the computation of thermoelastic dissipation in microdevices. In case of ultrathin resonators, the experiments show that damping is strongly influenced by size-dependent phenomena. In order to simulate the scale dependence of dissipation, an enhanced nonlocal coupled thermoelastic model is introduced and the first results are discussed.

Key concepts: Thermoelastic damping, Dissipation, Microelectromechanical systems, Resonator, Finite element method, Coupling (piping), Computation, Thermal management of electronic devices and systems

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