Research on A Novel R-¿ Wafer-handling Robot

In this paper, a novel 3 DOF R-θ wafer-handling robot, which can finish Z (up-down) movement, θ (rotation) movement, and R (radial linear stretching) movement, is presented. The mechanism and function are introduced in detail. With building the kinematics model and dynamics model of radial linear stretching component, the kinematics analysis and dynamics analysis are discussed. Based on MPC02 motion control card, the control system is formed. To meet the high velocity requirement, a time-optimal trajectory planning method with considering the constrained conditions is presented. The application to practical example shows that the proposed method is simple and effective.