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2010•Transactions of Nonferrous Metals Society of ChinaRequires access

Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

G. Mahendran, V. Balasubramanian, Thiagarajan Senthilvelan

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Key concepts: Materials science, Diffusion bonding, Fusion welding, Joint (building), Shear strength (soil), Diffusion, Microstructure, Welding

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