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2010•Unpublished venueRequires access

Infrared analysis of temperature distribution on the surface of a populated PCB

Radu Bunea, Ioan Plotog, Paul Mugur Svasta, Alena Pietriková, Juraj Ďurišin

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Abstract

The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules “in circuit” functional tests. In the paper are presented and analyzed the methods emphasizing the differences between solder joints resulting from different soldering processes via analysis of their functional temperatures in the same electrical parameters of the measurement circuits.

About this research paper

What this paper is about

The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules “in circuit” functional tests. In the paper are presented and analyzed the methods emphasizing the differences between solder joints resulting from different soldering processes via analysis of their functional temperatures in the same electrical parameters of the measurement circuits.

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Method / approach

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Available abstract

The paper is the result of thermovision experiments regarding the measurements of the temperature distribution on the surface of populated printed circuit board (PCB) in order to develop evaluation methods for solder joints quality as result of soldering process and for electronic modules “in circuit” functional tests. In the paper are presented and analyzed the methods emphasizing the differences between solder joints resulting from different soldering processes via analysis of their functional temperatures in the same electrical parameters of the measurement circuits.

Key concepts: Surface (topology), Distribution (mathematics), Environmental science, Remote sensing, Geology, Mathematics, Geometry, Mathematical analysis

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