2002•Unpublished venueRequires access
Solder bumping methods for flip chip packaging
G.A. Rinne
Open publisher page 39 citations
Abstract
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.