Electron emission from gated silicide field emitter arrays
M. Takai, T. Iriguchi, H. Morimoto, A. Hosono, S. Kawabuchi
Abstract
M. Takai, T. Iriguchi, H. Morimoto, A. Hosono, S. Kawabuchi
Abstract
Silicidation of the top surface of Si tips with a Nb gate structure has been carried out to improve the emission behavior of Si field emitter arrays (FEAs). A Pt layer with a thickness of 5–10 nm was deposited through the gate opening and annealed at 850 °C. The electron emission was enhanced by a factor of 10 and the average emission per tip was 3.5 μA for a 10×10 FEA. Fowler–Nordheim plots indicated the decrease in work function after silicidation.
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Silicidation of the top surface of Si tips with a Nb gate structure has been carried out to improve the emission behavior of Si field emitter arrays (FEAs). A Pt layer with a thickness of 5–10 nm was deposited through the gate opening and annealed at 850 °C. The electron emission was enhanced by a factor of 10 and the average emission per tip was 3.5 μA for a 10×10 FEA. Fowler–Nordheim plots indicated the decrease in work function after silicidation.
Key concepts: Field electron emission, Common emitter, Work function, Materials science, Optoelectronics, Electron, Silicide, Field emitter array