Wafer-level assembly of carbon nanotube networks using dielectrophoresis
Andrew H. Monica, S. J. Papadakis, Robert Osiander, Makarand Paranjape
Abstract
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Andrew H. Monica, S. J. Papadakis, Robert Osiander, Makarand Paranjape
Abstract
Open-access reader
We use dielectrophoresis (DEP) to controllably and simultaneously assemble multiple carbon nanotube (CNT) networks at the wafer level. By an appropriate choice of electrode dimensions and geometry, an electric field is generated that captures CNTs from a sizable volume of suspension, resulting in good CNT network uniformity and alignment. During the DEP process, the electrical characteristics of the CNT network are measured and correlated with the network morphology. These experiments give novel insight into the physics of DEP assembly of CNT networks, and demonstrate the scalability of DEP for future device applications.
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We use dielectrophoresis (DEP) to controllably and simultaneously assemble multiple carbon nanotube (CNT) networks at the wafer level. By an appropriate choice of electrode dimensions and geometry, an electric field is generated that captures CNTs from a sizable volume of suspension, resulting in good CNT network uniformity and alignment. During the DEP process, the electrical characteristics of the CNT network are measured and correlated with the network morphology. These experiments give novel insight into the physics of DEP assembly of CNT networks, and demonstrate the scalability of DEP for future device applications.
Key concepts: Dielectrophoresis, Materials science, Carbon nanotube, Wafer, Nanotechnology, Electric field, Electrode, Nanotube