2008•Unpublished venueRequires access

Application of Holography to evaluation of printed circuit board connector due to thermal stress

Hiromichi Kubota, Masanari Taniguchi, Shosuke Suzuki, Tasuku Takagi

Abstract

Printed circuit board connectors (PCB connectors) were tested by using the HPMS (Holographic Pattern Measuring System) , that has been developed by the authors to estimate the surface deformation due to thermal stress. The system was well performed to investigate the PCB connector contact failure process as a model investigation. The analysis was only on a stage of qualitative, however, some important suggestions were obtained for the future usage and selection of not only PCB connector itself but also selection of socket pin for power supply in the selected connector.

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Available abstract

Key concepts: Cable gland, Printed circuit board, Stress (linguistics), Deformation (meteorology), Materials science, Mechanical engineering, Computer science, Electrical engineering