Dependence of Dielectric Properties on Zn-Based Ceramic Fillers of the Polystyrene-Matrix Composites
Chang Jun Jeon, Ha Da Jang, Eung Soo Kim
Abstract
Chang Jun Jeon, Ha Da Jang, Eung Soo Kim
Abstract
Effects of ZnTa2O6, ZnWO4 and ZnMoO4 (Zn-based) ceramic content on the dielectric properties of Polystyrene (PS)/Zn-based ceramic composites were investigated as a function of frequency. With increasing of Zn-based ceramic content, the dielectric constant (K) and dielectric loss (tan δ) of the composites were increased. These results are due to the connectivity among the ceramic particles and interfacial polarization between PS and ceramics. Several types of theoretical models have been employed to predict the effective dielectric constant of the composites. The temperature coefficient of resonant frequency (TCF) was also discussed for thermal stability of the composites.
A significance statement is not available in the OpenAlex record.
A contribution statement is not available in the OpenAlex record.
Method details are not available in the OpenAlex metadata.
Findings are not separately available in the OpenAlex metadata.
Limitations are not available in the OpenAlex metadata.
Application details are not available in the OpenAlex metadata.
Effects of ZnTa2O6, ZnWO4 and ZnMoO4 (Zn-based) ceramic content on the dielectric properties of Polystyrene (PS)/Zn-based ceramic composites were investigated as a function of frequency. With increasing of Zn-based ceramic content, the dielectric constant (K) and dielectric loss (tan δ) of the composites were increased. These results are due to the connectivity among the ceramic particles and interfacial polarization between PS and ceramics. Several types of theoretical models have been employed to predict the effective dielectric constant of the composites. The temperature coefficient of resonant frequency (TCF) was also discussed for thermal stability of the composites.
Key concepts: Materials science, Composite material, Ceramic, Dielectric, Polystyrene, Ceramic matrix composite, Dielectric loss, Thermal stability