2006•IEEE Transactions on Advanced PackagingRequires access

Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package"

T.K. Lee, Sam S. Y. Zhang, C.C. Wong, A.C. Tan

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Key concepts: Flip chip, Chip-scale package, Chip, Joint (building), Computer science, Scale (ratio), Thermal copper pillar bump, Electronic engineering

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Correction to "A Novel Joint-in-Via Flip-Chip Chip-Scale Package" — Research Paper | ScholarLens