Experiments and Numerical Simulation of Hot Bending and Die Quenching for Ultra-High Strength Boron Steel
Jun Bao, Zhong Wen Xing, Bao Yu Song, Yu Ying Yang, Hong Sheng Liu
Abstract
Jun Bao, Zhong Wen Xing, Bao Yu Song, Yu Ying Yang, Hong Sheng Liu
Abstract
Hot bending and die quenching for U-shaped parts with ultra-high strength boron steel were experimented and simulated to study its quenching effect and accuracy. The results indicate that through the hot contact bending and die quenching, bending parts with higher strength and forming precision than that of cold stamping can be achieved. And the hot contact bending improves the quenching effect at the bottom of the bending part. The springback of hot contact bending decreases gradually when the blank holder force (BHF) increases, which is mainly negative for the impact of the thermal shrinkage moments. The numerical simulation results are consistent with the experiments’. Therefore, it verifies the reliability of finite element model and lays the foundation for the numerical simulation of the hot stamping process applied in complicated shape parts’ production.
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Hot bending and die quenching for U-shaped parts with ultra-high strength boron steel were experimented and simulated to study its quenching effect and accuracy. The results indicate that through the hot contact bending and die quenching, bending parts with higher strength and forming precision than that of cold stamping can be achieved. And the hot contact bending improves the quenching effect at the bottom of the bending part. The springback of hot contact bending decreases gradually when the blank holder force (BHF) increases, which is mainly negative for the impact of the thermal shrinkage moments. The numerical simulation results are consistent with the experiments’. Therefore, it verifies the reliability of finite element model and lays the foundation for the numerical simulation of the hot stamping process applied in complicated shape parts’ production.
Key concepts: Hot stamping, Materials science, Quenching (fluorescence), Bending, Die (integrated circuit), Boron, Blank, Computer simulation