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An data exchange methodology of CAD and virtual assembly system

An-sheng Li, Xiaobin Shen

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Abstract

Obtaining data from CAD system is the first step for virtual assembly system to verify the rationality of design. A feature-based integrated product model in virtual assembly system is a hierarchical information model and can be presented by polygon layer, B-Rep layer, feature layer and so on. Reconstruction method from CAD to virtual assembly system was proposed for information translation. An integration methodology by using XML-based neural file and triangle polygon model file, translation is completed and information contained in the model is transformed. The solution provides data share very well.

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What this paper is about

Obtaining data from CAD system is the first step for virtual assembly system to verify the rationality of design. A feature-based integrated product model in virtual assembly system is a hierarchical information model and can be presented by polygon layer, B-Rep layer, feature layer and so on. Reconstruction method from CAD to virtual assembly system was proposed for information translation. An integration methodology by using XML-based neural file and triangle polygon model file, translation is completed and information contained in the model is transformed. The solution provides data share very well.

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Available abstract

Obtaining data from CAD system is the first step for virtual assembly system to verify the rationality of design. A feature-based integrated product model in virtual assembly system is a hierarchical information model and can be presented by polygon layer, B-Rep layer, feature layer and so on. Reconstruction method from CAD to virtual assembly system was proposed for information translation. An integration methodology by using XML-based neural file and triangle polygon model file, translation is completed and information contained in the model is transformed. The solution provides data share very well.

Key concepts: Computer science, XML, CAD, Polygon (computer graphics), Layer (electronics), Feature (linguistics), Data model (GIS), Data exchange

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