2009•Unpublished venueRequires access

Adhesive bonding of polymeric microfluidic devices

C.S. Goh, S. C. Tan, Khin Thet May, Cong Zhi Chan, Sum Huan Ng

Abstract

This paper investigates the use of adhesive bonding on polymeric microfluidic devices. Both pressure sensitive and UV curable adhesives have been studied. Characterization tests conducted include flow, pressure and 180° peel tests. All the five adhesives are able to pass the flow and pressure tests. Pressure sensitive adhesives generally perform better than UV curable adhesives in the peel tests due to the different substrates used. With careful application of the adhesives, UV curable adhesives show less sagging into the microfluidic channels as compared to pressure sensitive adhesives.

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Key concepts: Adhesive, Pressure sensitive, Materials science, Microfluidics, Composite material, Adhesive bonding, Nanotechnology, Layer (electronics)