Research on Pyrolysis Analysis and Morphology Change of Waste Computer Mainboard
Hui Jiang, Hai Yan Chen
Abstract
Hui Jiang, Hai Yan Chen
Abstract
Pyrolysis analysis of waste computer mainboard was carried out at heating rate of 10 °C /min, 20°C/min and 25 °C/min in nitrogen atmosphere. The thermogravimetric analysis result shows that the weight loses change in three steps: the curve of TG is smooth from room temperature to 300°C in the first step, which possess about 1 percent of the total weight. The weight loses abruptly increase from 300 °C to 450 °C in the second step, and the curve of TG recoveries to be smooth at the temperature of 450 °C, that is the third step. There is an evident exothermic peak and an evident endothermic peak during the pyrolysis process, the exothermic peak is due to the thermal decomposition of waste computer mainboard, the endothermic peak is related to the melting of copper. At the same time the pyrolysis process make the surface morphology and elevation morphology change. The experimental study provided valuable basis for the industrial recovery of waste computer mainboard.
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Pyrolysis analysis of waste computer mainboard was carried out at heating rate of 10 °C /min, 20°C/min and 25 °C/min in nitrogen atmosphere. The thermogravimetric analysis result shows that the weight loses change in three steps: the curve of TG is smooth from room temperature to 300°C in the first step, which possess about 1 percent of the total weight. The weight loses abruptly increase from 300 °C to 450 °C in the second step, and the curve of TG recoveries to be smooth at the temperature of 450 °C, that is the third step. There is an evident exothermic peak and an evident endothermic peak during the pyrolysis process, the exothermic peak is due to the thermal decomposition of waste computer mainboard, the endothermic peak is related to the melting of copper. At the same time the pyrolysis process make the surface morphology and elevation morphology change. The experimental study provided valuable basis for the industrial recovery of waste computer mainboard.
Key concepts: Endothermic process, Exothermic reaction, Thermogravimetric analysis, Pyrolysis, Decomposition, Thermal decomposition, Morphology (biology), Materials science