2010Applied Mechanics and MaterialsOpen access

Numerical Simulation Investigation on the Temperature Field Distribution and Variations in Hot Stamping Process

Lei Zhang, Guo Qun Zhao, Hui Ping Li

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Abstract

With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

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What this paper is about

With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

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Available abstract

With finite element software Abaqus, a coupled thermal mechanical simulation of hot stamping process of U-Channel part using high strength steel was performed. Through the analysis of the temperature field distribution on the die surface, the influence of contact state between die and blank on the temperature field distribution was discussed. With temperature history curve of a selected node on die corner, the heat flow on two contact boundaries (die surface and cooling water channel surface) was discussed and its effects rules on the die temperature were given.

Key concepts: Die (integrated circuit), Blank, Hot stamping, Finite element method, Stamping, Computer simulation, Materials science, Field (mathematics)

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