2000•MRS ProceedingsRequires access

Integrated CVD-PVD Al Plug Process for Sub-Quarter Micron Devices: Effects of Underlayer on the Via Filling and the Microstructure of the Al Film

Won‐Jun Lee, Jungjoo Kim, Jun Ki Kim, Jin Won Park, Hyug Jin Kwon, Heung Lak Park, Sa‐Kyun Rha

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Key concepts: Materials science, Physical vapor deposition, Tin, Microstructure, Chemical vapor deposition, Composite material, Layer (electronics), Texture (cosmology)

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