ScholarLens Back to search
2008•Journal of Electronic MaterialsOpen access

Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis

Yi‐Shao Lai, Chin‐Li Kao

Open full text 17 citations

Abstract

This record does not include an abstract. Use the full-text link above if available.

Open-access reader

About this research paper

What this paper is about

An abstract is not available in the OpenAlex record for this paper.

Why it matters

OpenAlex reports 17 citations for this work. Citation counts describe recorded attention and do not establish research quality.

Key contribution

A contribution statement is not available in the OpenAlex record.

Method / approach

Method details are not available in the OpenAlex metadata.

Main findings

Findings are not separately available in the OpenAlex metadata.

Limitations

Limitations are not available in the OpenAlex metadata.

Applications

Application details are not available in the OpenAlex metadata.

Key concepts: Electromigration, Current crowding, Joule heating, Flip chip, Current density, Soldering, Materials science, Reliability (semiconductor)

Related papers

Related paper 1Related paper 2Related paper 3
Back to paper searchBrowse research topicsOriginal source
Calibration of Electromigration Reliability of Flip-Chip Packages by Electrothermal Coupling Analysis — Research Paper | ScholarLens