Junction temperature simulation of multichip module LED package

This study presents the development of a high power (15 W) chip on board (COB) type package with multiarray module for 200 W light emitting diode (LED) lamp system. The LED device is COB package that is mounted directly on the metal PCB to reduce thermal resistance from the chip to PCB. Numerical simulation was performed to investigate the maximum junction temperature of the LED package by using the computational fluid dynamics solver, FLOTHERM V.9·2. The simulation result was compared to the experimental data. The influences of various operational conditions such as dissipation power, the number of chip arrays and the orientation of heat sink on the junction temperature were discussed. Efficient methodologies of reducing the junction temperature were also proposed in this study. This paper presents a simple algorithm to predict the thermal resistance/junction temperature of the high power LED module. The results provide useful information for the optimum design of the heat sink and the development of multiarray modules.